XYALIS at SPIE Photomask conference 2024
Time to update your Mask Data Preparation flow? XYALIS offers cutting-edge MDP solutions tailored to your workflow. Work with our customer oriented team to boost your MDP productivity through customized, production-proven engines that seamlessly integrate with your existing flow. From …
XYALIS at DAC Conference 2024: #booth 2516
XYALIS celebrates 26 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …
Beyond tape-out: open the dark side
XYALIS is excited to announce its participation in the FSiC2024 Free Silicon Conference in Paris, Sorbonne University, on June 20th, 2024. We will be presenting an article titled “Beyond Tape-Out: Exploring the Dark Side.” While the various steps of chip …
Minimizing die fracture in 3DIC die integration
XYALIS, in collaboration with Mosis, has published a new article in the Journal of Micro/Nanopatterning, Materials, and Metrology about “Minimizing die fracture in 3DIC die integration”. The demand for high-performance semiconductor products has led to reduced wafer feature size, lowered …
XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems
Grenoble, December 18th 2023XYALIS is proud to announce, under the European Union Defence Fund, the start of the Hartroid project. Hartroid stands for “Hardware Trojans Identification in Large-Scale integrated circuits”. Hartroid will develop a solution to detect Hardware Trojans (HT) …
