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XYALIS at SPIE Photomask 2019: Large Dies Stitching

XYALIS will present a paper about “Large dies stitching: a technical and cross-functional teams challenge.” at the poster session.

This paper addresses large dies stitching challenges. Stitching is a way to combine several shots “stitched together” to create a die larger than what can fit on a photomask. This technique was originally dedicated to advanced research. Now it is more widely used and requires a fully automated industrial flow. Technical constraints come from a number of different actors and results must be shared by even more teams. We will present the methodology used to optimize both the yield and the data exchange between cross-functional teams. Then we will show how this automated flow can be easily customized to save more silicon thanks to advanced dicing techniques.

We will also present our latest Mask Data Preparation (MDP) tools version. After adding connections capabilities to any SQL database server, we have added functionalities to face new challenges for 3D chips, stitching, etc. Frame generation, with GOTframe solution, has never been so easy to setup for the latest process requirements. The parallel computation option allows to insert hundreds of structures with complex constraints in empty scribe lines in seconds.
In our MPW editor, GOTmuch, we have added new scripting functions to access any SQL database server. Customer can now use KLayout in GOTmuch to view or edit a GDSII or OASIS database.

Visit us on booth #215 to know more about what we have achieved in Mask Data Preparation at the next SPIE Photomask Technology Conference, September 15-19, 2019, in Monterey, California, USA.

Exhibition dates and hours:

Tuesday, September 17 from 10:00 am to 4:00 pm
Wednesday, September 18 from 10:00 am to 4:00 pm

 

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