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Mask Data Preparation

  • Generation of Multi Project Wafers (MPWs) or shuttles
  • Generation of complex reticles
  • Intuitive mask set creation
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Dummy Filling

  • 3rd Generation of dummy filling
  • High speed parallel processing
  • Available at chip level, reticle level or wafer level
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Toolbox

  • Powerful toolbox for GDSII, OASISย ยฎ, Mebes operations
  • High reliability for last minute updates
  • Secure your tapeout
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XYALIS at JEVeC conference 2023 in Japan

XYALIS will be present at the JEVeC 2023 Day (Japan EDA Venture Liaison Committee) in Kawasaki, November 27th, 2023. We will present our solution for frame generation step that plays... [Continue Reading]

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News & Press

XYALIS at SPIE Photomask conference 2023


- XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching,... [Continue Reading]

XYALIS at DAC conference 2023 : booth #2455


- XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching,... [Continue Reading]

Minimizing die fracture in three-dimensional IC


- XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography... [Continue Reading]
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