Mask Data Preparation
- Generation of Multi Project Wafers (MPWs) or shuttles
- Generation of complex reticles
- Intuitive mask set creation
Dummy Filling
- 3rd Generation of dummy filling
- High speed parallel processing
- Available at chip level, reticle level or wafer level
Toolbox
- Powerful toolbox for GDSII, OASIS ®, Mebes operations
- High reliability for last minute updates
- Secure your tapeout
XYALIS at SPIE Photomask conference 2023
July 18th, 2023
XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP).
With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask... [Continue Reading]
News & Press
XYALIS at DAC conference 2023 : booth #2455
June 9th, 2023 - News XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching,... [Continue Reading]
Minimizing die fracture in three-dimensional IC
March 3rd, 2023 - News XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography... [Continue Reading]
Single-pass frame generation for multi-layer 3D circuits
January 2nd, 2023 - News XYALIS, in collaboration with ST Microelectronics, has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been... [Continue Reading]
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To build reliable flows involving data exchange with other tools and equipments, XYALIS is fully compliant with SEMI standards. |
