Mask Data Preparation

  • Generation of Multi Project Wafers (MPWs) or shuttles
  • Generation of complex reticles
  • Intuitive mask set creation
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Dummy Filling

  • 3rd Generation of dummy filling
  • High speed parallel processing
  • Available at chip level, reticle level or wafer level
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  • Powerful toolbox for GDSII, OASIS ®, Mebes operations
  • High reliability for last minute updates
  • Secure your tapeout
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Minimizing die fracture in three-dimensional IC

XYALIS, in collaboration with Mosis, has published an article about "Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns".

This result has been presented in... [Continue Reading]


News & Press

Single-pass frame generation for multi-layer 3D circuits

- XYALIS, in collaboration with ST Microelectronics,  has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been... [Continue Reading]

November’22: New Release

- Grenoble – November 30th, 2022 – Today XYALIS unveils a new release bringing powerful improvements in the frame generation engine (GOTframe) and other tools. GOTframe – Frame Assembly Generation Engine Add new ordering items possibilities.... [Continue Reading]

XYALIS at SPIE Photomask 2022 : Single-pass frame generation for multi-layer 3D circuits

- XYALIS will present a paper about “Single-pass frame generation for multi-layer 3D circuits” at the poster session. This paper presents a novel approach to automatically build frames for 3D chips. These chips may be obtained... [Continue Reading]
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