Mask Data Preparation
- Generation of Multi Project Wafers (MPWs) or shuttles
- Generation of complex reticles
- Intuitive mask set creation
Dummy Filling
- 3rd Generation of dummy filling
- High speed parallel processing
- Available at chip level, reticle level or wafer level
Toolbox
- Powerful toolbox for GDSII, OASIS ®, Mebes operations
- High reliability for last minute updates
- Secure your tapeout
Minimizing die fracture in three-dimensional IC
March 3rd, 2023
XYALIS, in collaboration with Mosis, has published an article about "Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns".
This result has been presented in... [Continue Reading]
News & Press
Single-pass frame generation for multi-layer 3D circuits
January 2nd, 2023 - News XYALIS, in collaboration with ST Microelectronics, has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been... [Continue Reading]
November’22: New Release
November 30th, 2022 - News Grenoble – November 30th, 2022 – Today XYALIS unveils a new release bringing powerful improvements in the frame generation engine (GOTframe) and other tools. GOTframe – Frame Assembly Generation Engine Add new ordering items possibilities.... [Continue Reading]
XYALIS at SPIE Photomask 2022 : Single-pass frame generation for multi-layer 3D circuits
September 15th, 2022 - News XYALIS will present a paper about “Single-pass frame generation for multi-layer 3D circuits” at the poster session. This paper presents a novel approach to automatically build frames for 3D chips. These chips may be obtained... [Continue Reading]
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To build reliable flows involving data exchange with other tools and equipments, XYALIS is fully compliant with SEMI standards. |
