Mask Data Preparation

  • Generation of Multi Project Wafers (MPWs) or shuttles
  • Generation of complex reticles
  • Intuitive mask set creation
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Dummy Filling

  • 3rd Generation of dummy filling
  • High speed parallel processing
  • Available at chip level, reticle level or wafer level
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  • Powerful toolbox for GDSII, OASIS ®, Mebes operations
  • High reliability for last minute updates
  • Secure your tapeout
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Design Driven Dummy Filling

Grenoble – July 21th, 2021

XYALIS has set up a new methodology to allow an efficient design driven dummy filling technique. The result has been presented in a paper during the 2021 International Symposium on Electrical, Electronics and Information Engineering, Seoul, Republic of Korea, February 19 – 21, 2021.

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News & Press

Geometric based signature – US patent issuance

- Grenoble – June 29th, 2021 XYALIS,  is proud to announce that the United States Patent and Trademark Office (USPTO) has issued U.S. Patent No. 10,956,368 (March 23, 2021 – application number 16/961,375, equivalent to European... [Continue Reading]

May’21: New Release

- Grenoble – May 12th, 2021 – Today XYALIS unveils a new release bringing powerful improvements to increase OASIS® reading/writing operations performance.  Compression and decompression functions have been optimized so that reading or writing an OASIS® file... [Continue Reading]

Reducing stress effects on multi-project-wafer reticles

- Collaborating with MOSIS by using GOTmuch and GOTfiller, XYALIS has set up a new methodology to MPW yield and control CPI. The result has been presented in a paper during the SPIE Advanced Lithography online... [Continue Reading]