Mask Data Preparation
- Generation of Multi Project Wafers (MPWs) or shuttles
- Generation of complex reticles
- Intuitive mask set creation
Dummy Filling
- 3rd Generation of dummy filling
- High speed parallel processing
- Available at chip level, reticle level or wafer level
Toolbox
- Powerful toolbox for GDSII, OASIS ®, Mebes operations
- High reliability for last minute updates
- Secure your tapeout
Design Driven Dummy Filling
Grenoble – July 21th, 2021
XYALIS has set up a new methodology to allow an efficient design driven dummy filling technique. The result has been presented in a paper during the 2021 International Symposium on Electrical, Electronics and Information Engineering, Seoul, Republic of Korea, February 19 – 21, 2021.
News & Press
Geometric based signature – US patent issuance
June 29th, 2021 - News Grenoble – June 29th, 2021 XYALIS, is proud to announce that the United States Patent and Trademark Office (USPTO) has issued U.S. Patent No. 10,956,368 (March 23, 2021 – application number 16/961,375, equivalent to European... [Continue Reading]
May’21: New Release
May 12th, 2021 - News Grenoble – May 12th, 2021 – Today XYALIS unveils a new release bringing powerful improvements to increase OASIS® reading/writing operations performance. Compression and decompression functions have been optimized so that reading or writing an OASIS® file... [Continue Reading]
Reducing stress effects on multi-project-wafer reticles
March 11th, 2021 - News Collaborating with MOSIS by using GOTmuch and GOTfiller, XYALIS has set up a new methodology to MPW yield and control CPI. The result has been presented in a paper during the SPIE Advanced Lithography online... [Continue Reading]
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To build reliable flows involving data exchange with other tools and equipments, XYALIS is fully compliant with SEMI standards. |
