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Minimizing die fracture in three-dimensional IC

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XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography + Patterning, San Jose, California, …

Single-pass frame generation for multi-layer 3D circuits

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XYALIS, in collaboration with ST Microelectronics,  has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been presented in the SPIE Photomask …

Versions history

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Here is our tools versions history: GOTsuite_2211-30   Product name Version GOTarc 1.1c GOTcheck 1.5c GOTcif2db 2.2a GOTcross 3.1c GOTcsv2mch 2.0b GOTdb2cif 1.2c GOTdb2ps 1.2d GOTdeck 1.0b GOTdiff 1.4b GOTfig 2.1d GOTfiller 3.1b GOTframe 5.0b GOTghost-shape 2.0c GOTjob2msk 4.4a GOTlabel …

Design Driven Dummy Filling

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XYALIS has set up a new methodology to allow an efficient design driven dummy filling technique. It is used in our dummy filling tool GOTstyle. The result has been presented in a paper during the 2021 International Symposium on Electrical, Electronics …

Reducing stress effects on multi-project-wafer reticles

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Collaborating with MOSIS by using GOTmuch and GOTfiller, XYALIS has set up a new methodology to MPW yield and control CPI. The result has been presented in a paper during the SPIE Advanced Lithography online conference, California, USA, 22-26 february …



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