Resources Library - Publications

XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography + Patterning, San Jose, California, …

XYALIS, in collaboration with ST Microelectronics,  has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been presented in the SPIE Photomask …

XYALIS has set up a new methodology to allow an efficient design driven dummy filling technique. It is used in our dummy filling tool GOTstyle. The result has been presented in a paper during the 2021 International Symposium on Electrical, Electronics …

Collaborating with MOSIS by using GOTmuch and GOTfiller, XYALIS has set up a new methodology to MPW yield and control CPI. The result has been presented in a paper during the SPIE Advanced Lithography online conference, California, USA, 22-26 february …

Philippe Morey, Frederic Brault, Eric Beisser, Farid BenzakourXYALIS – Grenoble – FranceConference: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States ABSTRACT This paper addresses large dies stitching challenges. Stitching is a way to combine several shots ”stitched …