XYALIS at SPIE Photomask 2022 : Single-pass frame generation for multi-layer 3D circuits

XYALIS will present a paper about “Single-pass frame generation for multi-layer 3D circuits” at the poster session.

This paper presents a novel approach to automatically build frames for 3D chips. These chips may be obtained by stacking multiple dies, but are more often made by a backside wafer processing. This proposed flow works in a single pass and is based on a dedicated constraint-satisfaction software. In addition to the standard placement
rules, the different types of constraints used for 3D frames are clearly identified: alignment, overlapping, mirroring. The method to generate separate frames is described. Results and performance obtained in production, for frames involving two different manufacturing processes for wafer front and backside, are detailed.

Visit us to know more about what we have achieved in Mask Data Preparation at the next SPIE Photomask Technology Conference, September 15-19, 2022, Monterey Conference Center, 1 Portola Plaza, Monterey, California, USA.

Exhibition dates and hours:

  • Monday, September 26 from 6:00 pm to 7:30 pm : poster session at Monterey Marriott, San Carlos Ballroom 4
  • Tuesday, September 27 from 10:00 am to 4:00 pm
  • Wednesday, September 28 from 10:00 am to 4:00 pm


SPIE Photomask 2022-frame for 3D circuits




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