Mar’20: What’s new in XYALIS tools release

Grenoble – March 25th, 2020 – Today XYALIS unveils a new release bringing new powerful features in mask data preparation tools. It includes a python interpreter in GOTmuch, enhanced cut-sets management to improve silicon yield and support for Oracle® database connection.


  • We have enhanced cut-sets management. By default, chips must now be centered between the sawing lines used to retrieve them.
  • Possibility to fill remaining empty space by additional chips has been greatly improved. It is possible to control the increase of the number of cut-sets required to retrieve all the chips after this operation.
  • GOTcross now accepts frozen sawing lines, i.e. predefined lines than cannot be crossed by any chip.


  • We made many improvements in the solver engine to find better solutions (and more of them).
  • We have improved the inheritance of rotation and symmetry constraints at family level and these can be cancelled at item level.
  • GOTframe is now able to use any MUCH preference file and to include existing properties in the output file in addition to optionally exported families.
  • We have added an option to help debug by listing all used variables and their values.
  • It is possible to request centering of items in subdivision of scribe by specifying the size of the subdivision in –center-initial option,
  • We have added an option to request an isomorphic growth of the scribe: horizontal and vertical scribe grow simultaneously when needed.


  • Last but not least: GOTmuch now includes a python interpreter. Full automation can now be made with python scripts. All internal objects (the project, instances, master or sawing lines) are exposed as python objects with their attributes and methods. Note that TCL is still fully supported.
  • The connection to SQL DB has been extended to Oracle with which data can be exchanged without any other interface.
  • Additionally, management of cut-sets has been greatly improved. When displaying cut-sets (through GUI or with XLS or PDF output), chips correctly retrieved after dicing with symmetrical margins and chips possibly retrievable but without symmetrical margins are clearly identified.
  • It is also possible to specify a minimum distance between 2 sawing lines used on the same wafer.


  • CIF reader has been fully rewritten to be 100% compliant with CIF specifications. See:
  • A verbose option has been added as well as the possibility to get a cross-reference file for layer mapping between CIF and GDSII or OASIS database.

To get this new release, please contact our support team by writing to support[at]xyalis.com

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