News & Press subtitle

The OASIS format (Open Artwork System Interchange Standard) was introduced to address the growing complexity of chip design layouts and to overcome the limitations of the aging GDSII format. While it offers immense potential for more compact, efficient layout descriptions, …

Time to update your Mask Data Preparation flow? XYALIS offers cutting-edge MDP solutions tailored to your workflow. Work with our customer oriented team to boost your MDP productivity through customized, production-proven engines that seamlessly integrate with your existing flow. From …

XYALIS celebrates 26 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …

XYALIS is excited to announce its participation in the FSiC2024 Free Silicon Conference in Paris, Sorbonne University, on June 20th, 2024. We will be presenting an article titled “Beyond Tape-Out: Exploring the Dark Side.” While the various steps of chip …

XYALIS, in collaboration with Mosis, has published a new article in the Journal of Micro/Nanopatterning, Materials, and Metrology about “Minimizing die fracture in 3DIC die integration”. The demand for high-performance semiconductor products has led to reduced wafer feature size, lowered …