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XYALIS new version of GTmuch makes multi-chip modules and multi-project wafers even easier

Paris, France – Xyalis has announced a major upgrade to GTmuch, the company’s graphical tool dedicated to floorplanning and assembly of multiple GDSII databases for Multi-Chip Modules (MCM) and Multi-Project Chips or Wafers (MPC or MPW). At the same time Xyalis has updated its complete suite of GDSII utilities.

XYALIS marks North American Operations expansion with official opening of an office in San Jose

GRENOBLE, France, March 21st, 2008 Xyalis marks North American Operations expansion with official opening of an office in San Jose, California, announces Eric Beisser – CEO of Xyalis. Xyalis, the leader in layout finishing solutions, today officially announced the opening …

New release of our hybrid dummy fill tool, GTstyle

GRENOBLE, France, August 21st, 2007 In addition to all exclusive functionnalities such as roughness management or parasitics reduction, GTstyle v2.2 provides new great features:     Full Oasis compatibility     Management of multiple size dummy cells     Automatic interconnection of dummy …

XYALIS announce an Advanced Methodology for Building CMP Models

GRENOBLE, France – June 1st, 2007 XYALIS will be able to provide high accuracy thickness measurements on wafers. XYALIS announce today that thanks to “non destructive” nanometric measurement equipment’s, XYALIS is able to build Chemo Mechanical Planarization (CMP) models. These …

XYALIS announced today OASIS support for its family of layout finishing tools

GRENOBLE, France – November 20th, 2006 With files size explosion at 65nm and 45nm nodes, OASIS becomes a must have alternative for mask prep and layout finishing tasks. OASIS can achieve a compression ratio in the range of 10X for …



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