Name Definition
ARRAY Defines either a matrix of DIEs in a FIELD when a PRODUCT is repeated, either a matrix of FIELDs on a MASK
BARCODE One of the PLACEMARKs dedicated to MASK identification
BLANK Physical substrate used for mask writing
CD Pattern for Control of Dimensions placed in a FIELD. A CD can be inside or outside of a DEVICE
CHIP Physical piece of silicon corresponding to the PRODUCT on processed WAFER
DATABASE Graphic description of a DEVICE within a file. The most common file format are GDSII, OASISยฎ and MEBES
DEVICE One of the structures written on a MASK. A DEVICE can be of type DIE, FRAME, PLACEMARK,….
DIE The pattern corresponding to one CHIP on a mask MASK. A DIE is always contained in a FIELD
FIDUCIAL A kind of PLACEMARK dedicated to mask alignment
FIELD Area of a MASK used for photo exposure. A MASK may contain multiple FIELDs
FRAME Set of ITEMs used during wafer processing and placed around the DIEs within a FIELD
ITEM One of the patterns of the FRAME. An item may be used for mask alignment, process control monitoring, identification, etc…
JOB DECK Placement description of all the various patterns on a BLANK
JOB REQUEST Request submitted by the designers to build all the masks needed to process a given PRODUCT
KERF Other name of FRAME
LAYER Graphic description of one step of WAFER processing within original design DATABASE
LEVEL One photolithography step for WAFER processing. A graphic LEVEL description may be deduced from the various LAYERs. One LEVEL is related to at least one FIELD. One MASK may contain multiple LEVELS (MLR)
MASK Physical media used for photolithography (a processed BLANK)
MASK REQUEST Request submitted by mask data prep to the Mask Shop
MASK SET A set of different MASKs used to process different levels of the same CHIP
MASK SHOP Also known as MASK HOUSE. Performs all physical mask processing: writing, inspection, cleaning
MDP Mask Data Prep: data processing of all files prior to mask writing: FRAME generation, fracturing, etc…
MLR Multi Level Reticle. Techniques using multiple fields on a same mask. Each FIELD represents a different LEVEL
OPC Optical Proximity Correction. Data processing performed on elementary geometries to compensate optical distortions (diffraction…)
OVERLAY Coincidence of the patterns on 2 different MASKs of a same SET. See REGISTRATION
PCM Process Control Module: a structure used during or after wafer processing to qualify the different parameters of the process. PCM are placed in a FIELD, either in the SCRIBES of a DIE array or in a separate FIELD
PROCESS The multiple steps for WAFER fabrication
PRODUCT A kind of DEVICE delivered by designers to produce a silicon CHIP
PLACEMARK Pattern used for identification, fabrication or alignment of theย ย ย  MASK. A PLACEMARK is not printed on the wafer is is outside of any FIELD.
REGISTRATION Measure of OVERLAY errors between 2 masks
RET Reticle Enhancement Technology. Methods to improve optical resolution of MASKs
RETICLE An other name for MASKs. Usually RETICLE is used for MASKs with photo-repetition
SCRIBE Gap between 2 adjacent DIEs on a wafer. SCRIBEs are destroyed when sawing the wafer but may contain any ITEM useful during PROCESS
STEP Distance between the centers of two identical patterns. We can differentiate the DIE STEP which is the distance between the centers of 2 adjacent CHIPS on the wafer and the PHOTO STEP which is the move of the stepper between 2 photo shots
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