XYALIS at JEVeC conference 2023 in Japan
XYALIS will be present at the JEVeC 2023 Day (Japan EDA Venture Liaison Committee) in Kawasaki, November 27th, 2023. We will present our solution for frame generation step that plays a critical role in mask data preparation flow. Abstract Frame …
XYALIS at SPIE Photomask conference 2023
XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …
XYALIS at DAC conference 2023 : booth #2455
XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching, mask order form generation, chip …
Minimizing die fracture in three-dimensional IC
XYALIS, in collaboration with Mosis, has published an article about “Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns”. This result has been presented in the SPIE Advanced Lithography + Patterning, San Jose, California, …
Single-pass frame generation for multi-layer 3D circuits
XYALIS, in collaboration with ST Microelectronics, has published an article about a new methodology to automatically build a single-pass frame for multi-layer 3D circuits.This new methodology uses our frame generation tool GOTframe. This result has been presented in the SPIE Photomask …
